IMIKHIQIZO

Uhlobo lwe-Element: I-Thin Film Platinum Resistance Thermistor
Ubukhulu be-elementi:2.0mm x 2.3mm x 1.0mm, 1.6mm x 2.0mm x 1.0mm, 1.2mm x 2.0mm x 1.0mm
Izicaciso zokuhola:Ubude: 10 mm, Ububanzi: 0.2 mm
Izinto eziholayo: Intambo ye-platinum-nickel (ongakukhetha: isiliva-palladium/iplatinum/isiliva-nickel)
Amandla Okuqina Okuholayo:≥9 N
Ukumelana Nokufakwa Kwamandla:100 MΩ ku-20°C, >2 MΩ ku-500°C
I-Temperature Coefficient (TCR):3850 ppm/°C
Ukusebenza Kwamanje:0.3 ~ 1 mA (umphumela wokuzishisa uzocatshangelwa)
Ukuzinza Kwesikhathi Eside:≤±0.04% ukumelana nokukhukhuleka ngemva kwamahora angu-1000 ku-500°C
Isikhathi sokuphendula:[Ukugeleza (V=0.4 m/s)]t0.5 = 0.05 s,t10 = 0.15 s[Ukugeleza komoya (V=2 m/s)]t0.5 = 3 s,t10 = 10 s
I-Self-Heating Coefficient:0.4°C/mW
Ukumelana Nokudlidliza:≥40g ukusheshisa (ububanzi obungu-10 ~ 2000 Hz)
Ukumelana Nokwethuka:≥100g ukusheshisa (8 ms half-sine wave)
Ukupakisha:Ukupakisha kwepulasitiki ye-vacuum (amanye amafomethi wokupakisha atholakala uma ucelwa)

Uhlobo lwe-Element:SMD Thin Film Platinum Resistance Thermistor
Ubukhulu be-elementi:3.2mm x 1.6mm x 0.7mm
I-Temperature Coefficient (TCR):3850 ppm/°C
Izinga Lokukala Izinga lokushisa: -50°C kuya +200°C
Ukuzinza Kwesikhathi Eside:≤±0.06% ukumelana nokukhukhuleka kwe-R₀°C ngemva kwamahora angu-1000 ku-200°C
Uhlobo Lwetheminali:Amatheminali we-tin alloy
Indlela Yokuhlanganisa: I-Reflow soldering noma i-wave soldering. Okunamathiselwe kwe-solder okunezinga lokushisa eliphezulu kuyanconywa.
Ukushisa kwe-Soldering: 230-240 ° C

Uhlobo lwe-Element:I-Platinum Resistance Thermistor
Ubukhulu be-elementi:2.0mm x 2.3mm x 1.0mm, 2.0mm x 4.0mm x 1.0mm
Izicaciso zokuhola; Ubude: 10 mm, Ububanzi: 0.2 mm
Izinto eziholayo: Intambo yeplatinum-nickel (kuyakhetheka: isiliva-palladium/iplatinamu/isiliva elimsulwa)
Amandla Okuqina Okuholayo:≥9 N
Ukumelana Nokufakwa Kwamandla:100 MΩ ku-20°C, >2 MΩ ku-500°C
I-Temperature Coefficient (TCR):3850 ppm/°C
Ukusebenza Kwamanje:0.1–0.3 mA (umphumela wokuzishisa uzocatshangelwa)
Ukuzinza Kwesikhathi Eside:≤±0.04% ukumelana nokukhukhuleka kwe-R₀ (inkomba engu-0°C) ngemva kwamahora angu-1000 ku-500°C
Isikhathi sokuphendula:Ukugeleza kwamanzi (V=0.4 m/s):t₀.₅ = 0.05 s,t₀.₉ = 0.15 s;Ukugeleza komoya (V=2 m/s):t₀.₅ = 3 s,t₀.₉ = 10 s
I-Self-Heating Coefficient:0.4°C/mW (ku-0°C)
Ukumelana Nokudlidliza:≥40g ukusheshisa (ububanzi bemvamisa: 10–2000 Hz)
Ukumelana Nokwethuka:≥100g ukusheshisa (8 ms half-sine wave)
Ukupakisha:Ukupakisha kwepulasitiki ye-vacuum (amanye amafomethi wokupakisha atholakala uma ucelwa)